P r i n t e d
C i r c u i t
B o a r d
F a b r i c a t i o n
•
Quick-Turn Capabilities
• Low Cost
• SS up to 26 Layers
• Board Thickness up to .250”
• Prototype to High Volume Production Support
I n t e g r a t e d
C i r c u i t
R e c l a i m
& R e f u r b i s h m e n t
Reclaim
IC’s from machine attrition or scrap/obsolete
printed
circuit boards regardless of chip manufacturer or
package type
• BGA reballing
• Lead Straightening
• Re-tinning & Repackaging
• PCB Repair and Diagnostics; Chip to System
Level
C o p p e r
I n t e r c o n n e c t
P r o d u c t s
•
USB •
IEEE
1394 •
ATA
& DVI •
RF •
5/5E/6
- RJ-45 •
PDA •
Cell
Phone •
Power
Cords (International Available) •
External
Power Supplies •
Cable
Harness Assembly •
Phone
Jacks •
Etc.
